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E-mail info@axiomtek.com.tw

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IMB700

Status : Available

ATX Motherboard with LGA4189 Socket 3rd Gen Intel® Xeon® Scalable Processors, Intel® C621A, 3 PCIe x16, 3 PCIe x8, VGA, and NVMe

  • Features
  • Specifications
  • Ordering Information
  • Download

Features

  • 3rd gen Intel® Xeon® Scalable processors (Ice Lake-SP)
  • Six 288-pin DDR4-3200 RDIMM for up to 384GB of memory
  • 3 PCIe x1 and 3 PCIe x8
  • Supports M.2 Key M
  • TPM 2.0 supported (optional)
  • Supports multiple graphic cards
  • Supports internal USB dongle

The IMB700 is powered by the latest dual LGA4189 socket 3rd Gen Intel® Xeon scalable processors (code name: Ice Lake-SP) with the Intel® C621A chipset. The IMB700 offers rich expandability with three PCIe x16 slots, three PCIe x8 slots and M.2 Key M 2280 interface with PCIe x4 signal for adding GPUs, capture cards, RAID cards, high-speed NVMe storage, etc. Six SATA-600 ports with integrated RAID 0/1/5/10 are available for reliable data storage and protection. For a wide range of I/Os, it has an internal USB dongle, six USB 3.1 Gen1 ports, seven USB 2.0 ports, one RS-232/422/485 port, two GbE LAN ports with Intel® Ethernet controller i210-AT, one VGA port, eight-channel programmable digital I/O port, one HD Codec audio, SMBus, and one PS/2 keyboard and mouse. Trusted Platform Module 2.0 (TPM 2.0) is available to ensure critical information security. Furthermore, it can operate under a wide temperature range from 0°C to +60°C for use in harsh environments. More features include watchdog timer and hardware monitoring functions. Featured with built-in AI and crypto acceleration functions as well as advanced security capabilities, the IMB700 is targeted at markets requiring accelerating performance, high security, high-performance computing for efficient machine and deep learning workloads.

Specifications

CPU
  • 3rd gen Intel® Xeon® Scalable processors (TDP up to 270W)
Chipset
  • Intel® C621A
System Memory
  • 6 x DDR4-3200 R-DIMM ECC memory, up to 384GB
BIOS
  • AMI
COM
  • 1 x RS-232/422/485 (rear I/O)
USB
  • 4 x USB 3.1 Gen1 (rear I/O)
  • 2 x USB 3.1 Gen1 (internal box header)
  • 6 x USB 2.0 (internal box header)
  • 1 x USB 2.0 (180D TypeA)
Ethernet
  • 2 x 10/100/1000 Mbps Ethernet (Intel® i210-AT)
Display
  • 1 x VGA
Digital I/O
  • 8-channel programmable
Audio
  • HD Codec audio as MIC-in/Line-in/Line-out/Speaker-out with audio kit AX93242 (optional)
Storage
  • 6 x SATA-600 with RAID 0/1/5/10
  • M.2 key M 2280 slot with PCIe x4 signal
Expansion
  • 3 x PCIe x8
  • 3 x PCIe x16
Others
  • 1 x PS/2 keyboard and mouse
Battery
  • TBD
TPM
  • TPM 2.0 module (optional)
Watchdog Timer
  • 255 levels, 1 to 255 sec.
Hardware Monitoring
  • Yes
Operating Temperature
  • 0°C to +60°C (+32°F to +140°F)
Relative Humidity
  • 10% to 95% relative humidity, non-condensing
Dimensions
  • 305 x 244 mm
Board Thickness
  • 1.6 mm
Certifications
  • CE

Ordering Information

  • IMB700-S (P/N-E38F700101)
    ATX Motherboard with LGA4189 socket 3rd gen Intel® Xeon® scalable processors, Intel® C621A, 3 PCIe x16, 3 PCIe x8, VGA, and NVMe
  • 5938A808010E
    2 x USB 2.0 cable with bracket, P=2.54 mm, L=190 mm
  • 5938A808020E
    2 x USB 2.0 cable with bracket, P=2.54 mm, L=400 mm
  • 83935151000E
    TPM 2.0 module (AX93515)
  • E393242100
    AX93242-RC HD audio converter kit
  • 5948C122800E
    2 x USB 3.1 Gen1 cable with bracket, L=400 mm
  • 593826A0000E
    SATA signal cable/red, L=500 mm
  • 713WFB30000E
    IMB700_CL_LGA4189_4U_CPU above 205W
  • 713JYC1M000E
    IMB700_CL_LGA4189_2U_CPU under 205W

Download

Drivers

Date Description Version Download File
2023/03/08 Win10_Driver_LAN VA1.1
2023/03/08 Win10_Driver_Realtek Audio Driver VA1.1
2023/03/08 Win10_Driver_VROC Driver VA1.1
2023/03/08 Win10_Driver_AST2510 VA1.1
2023/03/08 Win10_Driver_Chipset VA1.1

Software

Manual

Date Description Version Download File
2023/03/08 IMB700 User's Manual VA1 VA1

Design Guide

Technical Announcement

Certificates

Date Description Version Download File
2021/12/03 UKCA Declaration of Conformity

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